JPS6236311Y2 - - Google Patents

Info

Publication number
JPS6236311Y2
JPS6236311Y2 JP1981182466U JP18246681U JPS6236311Y2 JP S6236311 Y2 JPS6236311 Y2 JP S6236311Y2 JP 1981182466 U JP1981182466 U JP 1981182466U JP 18246681 U JP18246681 U JP 18246681U JP S6236311 Y2 JPS6236311 Y2 JP S6236311Y2
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
pellet
emitting diode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981182466U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5887366U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18246681U priority Critical patent/JPS5887366U/ja
Publication of JPS5887366U publication Critical patent/JPS5887366U/ja
Application granted granted Critical
Publication of JPS6236311Y2 publication Critical patent/JPS6236311Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP18246681U 1981-12-08 1981-12-08 発光ダイオ−ド Granted JPS5887366U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18246681U JPS5887366U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18246681U JPS5887366U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS5887366U JPS5887366U (ja) 1983-06-14
JPS6236311Y2 true JPS6236311Y2 (en]) 1987-09-16

Family

ID=29980851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18246681U Granted JPS5887366U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5887366U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401788B (zh) * 2008-12-24 2013-07-11 Ind Tech Res Inst 發光二極體照明模組與封裝方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327769U (en]) * 1976-08-18 1978-03-09

Also Published As

Publication number Publication date
JPS5887366U (ja) 1983-06-14

Similar Documents

Publication Publication Date Title
US3805347A (en) Solid state lamp construction
US4529907A (en) Light emitting display device
JPH06104491A (ja) 発光ダイオードランプ
CN213693877U (zh) 一种车载高清摄像头
JPS6236311Y2 (en])
JP2922977B2 (ja) 発光ダイオード
CN209747894U (zh) 一种用于to封装ld激光器的封装结构
JPH06177427A (ja) 発光ダイオードランプ
JPH0563068U (ja) 樹脂封止型発光体
JPH07193282A (ja) 指向性の少ない赤外可視変換発光ダイオード
JP2519504Y2 (ja) 発光ダイオード
JPS6236312Y2 (en])
JPS5893388A (ja) 反射型光結合半導体装置の製造方法
CN112565565A (zh) 一种车载高清摄像头
JPH0521894Y2 (en])
JP2002232014A (ja) 発光ダイオードランプ
JPH0525257Y2 (en])
JPS603794B2 (ja) 発光表示装置
JPH0693525B2 (ja) 発光素子
JP4336734B2 (ja) 発光ダイオードおよびｌｅｄライト
JPS5791570A (en) Light module and manufacture therefor
JPS5868991A (ja) 半導体発光素子装置用ステムの製造方法
JPS6393177A (ja) 発光ダイオ−ド
JPS59222973A (ja) 半導体光結合装置
JPS5821187Y2 (ja) 発光ダイオ−ドランプ